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Document Preview Letter Agreement Re: Side Letter for Amendment to Payment Schedule of Series A-5 Additional Purchase Obligations, Waiver of Series A-5 Conditions, Conversion of Series A-4 Wafer Credits and Other Provisions |
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Title: |
Letter Agreement Re: Side Letter for Amendment to Payment Schedule of Series A-5 Additional Purchase Obligations, Waiver of Series A-5 Conditions, Conversion of Series A-4 Wafer Credits and Other Provisions |
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Entities: |
Alliance Semiconductor Corp.; Alliance Semiconductor Corp.; SanDisk Corp. |
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Date: |
2003 |
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Preview shows 1KB of 4KB total |
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Price: |
$30 |
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ID: |
#170651 |
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EXHIBIT 10.3
Date: April 14, 2003
To: Tower Semiconductor Ltd.
P.O. Box 619
Migdal Haemek 23105
Israel
Fax: +972-4-654-7788
Attention: Co-Chief Executive Officer
Re: SIDE LETTER FOR AMENDMENT TO PAYMENT SCHEDULE OF SERIES A-5 ADDITIONAL
PURCHASE OBLIGATIONS, WAIVER OF SERIES A-5 CONDITIONS, CONVERSION OF SERIES A-4
WAFER CREDITS AND OTHER PROVISIONS (COLLECTIVELY, THE "MS5 AGREEMENT")
Dear Sirs,
Reference is made to the MS5 Agreement, all capitalized terms not
defined herein shall be as defined therein. Subject to the last sentence of this
paragraph, each party hereto hereby agrees that in the event that pending their
approval of the terms of the MS5 Agreement, each of Bank Hapoalim B.M. and Bank
Leumi-Le-Israel Limited (the "Banks") agree to provide interim funding in the
amount of $33 million (in cash, letters of credit or bank guarantees), each
party hereto shall, no later than 2 business days following the date the
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